For the World's first full-scale social implementation! Liquid Metal Stretchable PCB Presented at international conferences in the U.S. and Singapore

Satosen Corporation (Location: Osaka City, Osaka; President: Keita Miyahara), which manufactures and sells stretchable circuit boards, gave invited presentations at two international conferences and events held in the United States and Singapore on its stretchable boards using liquid metal, which are under development. (Location: Osaka, Japan; President: Keita Miyahara) gave invited lectures at two international conferences and events held in the U.S. and Singapore.

World's first (according to our own research)

(1) The Future of Electronics RESHAPED (Boston, USA, June 11-12, 2025)

https://www.techblick.com/electronicsreshapedusa

(2) IEEE FLEPS 2025 (Singapore, June 22-25, 2025)

https://2025.ieee-fleps.org/

■Background

SATOSEN has been developing stretchable PCBs for about 10 years. Taking advantage of their flexibility and stretchability, which are significantly different from conventional printed circuit boards, they are increasingly being used in wearable devices for healthcare and sports applications.

At the same time, we launched a new generation of stretchable substrates last year that use liquid metal as a circuit material to further improve performance and durability, attracting significant attention within the industry.

Invited by two international conferences on printed/flexible electronics, our development manager gave a presentation on the development process and current status at the conferences.

About the Conferences

The Future of Electronics RESHAPED

The Future of Electronics RESHAPED is an international conference and exhibition in the field of electronics organized by TechBlick, an international event organizing platform. It was held at the University of Massachusetts Boston in Boston.

It focuses on the latest technologies and applications of next-generation electronics, such as flexible, printed, and sustainable electronics.

It is an important event where researchers and companies from around the world gather to discuss and network about the shape of future electronics and is considered one of the largest and most important conferences and exhibitions in this field in North America.

Talk at RESHAPED hosted by TechBlick (at the UMass Boston)

*IEEE FLEPS 2025

An international conference sponsored by IEEE (Institute of Electrical and Electronics Engineers) dedicated to flexible and printable sensor systems. At this conference, the latest research results and applications of electronic circuits made by printing technology on flexible materials will be presented.

Researchers and engineers from around the world gather to discuss future wearable devices and IoT technologies, and this year the conference was held in Singapore (National University of Singapore).

Talk at IEEE FLEPS 2025 (National University of Singapore)

■Progress in Development of Stretchable Substrates Using Liquid Metal

In both lectures, he talked about the company's stance and track record of adopting this development for full-scale social implementation and mass production. Participants were highly interested in the path to commercialization of liquid metals, which have often been discussed in the field of basic research, and there was a particularly strong response from European and U.S. manufacturers.

Some of the products have already started mass production for biological sensing applications, and further application expansion is expected.

Company Profile

Company name: SATOSEN CO.,LTD.

Representative: Keita Miyahara, President

Location: 3-7-27 Tsumori, Nishinari-ku, Osaka, 557-0062, Japan

Establishment: February 2012

Business description: Manufacture of industrial printed circuit boards

Capital: 99,540,000 yen

URL: https://www.satosen.co.jp/

For customer inquiries regarding this matter, please contact

SATOSEN

Inquiry form: https://www.satosen.co.jp/contact.html